The High Tech industry has gone through an exponential technology transformation in the last two decades. OEMs, particularly focused on consumer electronics are challenged with innovating newer, smaller and complex devices with increasing number and type of components and sub-systems, to deliver broader functionality. Smaller form factors are driving heat density, resulting in challenging component placement and packaging. At the organizational level, there is massive pressure on engineering teams to deliver broader and more innovative product configurations within shorter development cycles, while meeting all of the regulatory requirements.
In this two-part industry session, we will discuss how the MODSIM approach with the cloud-based 3DEXPERIENCE Works portfolio can help companies developing electronic devices or products with SOLIDWORKS, to accelerate innovation of super cool, robust and connected electronic devices. We will demonstrate values delivered by simulation workflows including: device drop test, 3-point bending, device thermal management, PCB signal integrity – power integrity- thermal, electromagnetic compliance, and injection molding of a plastic case.